IRF640N/S/L
Electrical Characteristics @ T J = 25°C (unless otherwise specified)
Parameter
Min.
Typ.
Max. Units
Conditions
V (BR)DSS
Drain-to-Source Breakdown Voltage
200
–––
––– V V GS = 0V, I D = 250μA
? V (BR)DSS / ? T J
Breakdown Voltage Temp. Coefficient
–––
0.25
–––
V/°C
Reference to 25°C, I D = 1mA
R DS(on)
Static Drain-to-Source On-Resistance
–––
–––
0.15
?
V GS = 10V, I D = 11A
?
––– R G = 2.5 ?
V GS(th)
g fs
I DSS
I GSS
Q g
Q gs
Q gd
t d(on)
t r
t d(off)
t f
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
2.0
6.8
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
10
19
23
5.5
4.0 V V DS = V GS , I D = 250μA
––– S V DS = 50V, I D = 11A ?
25 V DS = 200V, V GS = 0V
μA
250 V DS = 160V, V GS = 0V, T J = 150°C
100 V GS = 20V
nA
-100 V GS = -20V
67 I D = 11A
11 nC V DS = 160V
33 V GS = 10V, See Fig. 6 and 13
––– V DD = 100V
––– I D = 11A
ns
––– R D = 9.0 ? , See Fig. 10 ?
L D
L S
Internal Drain Inductance
Internal Source Inductance
–––
–––
4.5
7.5
–––
–––
nH
Between lead,
6mm (0.25in.)
from package
and center of die contact
G
D
S
C iss
C oss
C rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
1160
185
53
––– V GS = 0V
––– V DS = 25V
––– pF ? = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
Parameter
Min. Typ. Max. Units
Conditions
A
integral reverse
I S
I SM
V SD
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) ?
Diode Forward Voltage
MOSFET symbol
––– ––– 18
showing the
G
––– ––– 72
p-n junction diode.
––– ––– 1.3 V T J = 25°C, I S = 11A, V GS = 0V ?
D
S
t rr
Q rr
t on
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
––– 167 251 ns T J = 25°C, I F = 11A
––– 929 1394 nC di/dt = 100A/μs ?
Intrinsic turn-on time is negligible (turn-on is dominated by L S +L D )
Thermal Resistance
Parameter
Typ.
Max.
Units
R θ JC
R θ CS
R θ JA
R θ JA
Junction-to-Case
Case-to-Sink, Flat, Greased Surface ?
Junction-to-Ambient ?
Junction-to-Ambient (PCB mount) ?
–––
0.50
–––
–––
1.0
–––
62
40
°C/W
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